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Thermal Management for Opto-electronics Packaging and Applications
Hoofdkenmerken
Auteur: Xiaobing Luo; Run Hu; Bin Xie
Titel: Thermal Management for Opto-electronics Packaging and Applications
Uitgever: Wiley Global Research (STMS)
ISBN: 9781119179290
ISBN boekversie: 9781119179276
Editie: 1
Prijs: € 129.48
Verschijningsdatum: 29-05-2024
Inhoudelijke kenmerken
Categorie: General
Taal: English
Imprint: Wiley-Blackwell
Technische kenmerken
Verschijningsvorm: E-book
 

Inhoudsopgave:

\u003cp\u003e\u003cb\u003eA systematic guide to the theory, applications, and design of thermal management for LED packaging\u003c/b\u003e \u003cp\u003eIn \u003ci\u003eThermal Management for Opto-electronics Packaging and Applications\u003c/i\u003e, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. \u003cp\u003eThe authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. \u003cp\u003eThe book also includes: \u003cul\u003e\u003cli\u003eA thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials \u003c/li\u003e\u003cli\u003eComprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling\u003c/li\u003e \u003cli\u003ePractical discussions of thermally enhanced thermal interfacial materials (TIMs)\u003c/li\u003e \u003cli\u003eComplete treatments of hybrid thermal management in downhole devices\u003c/li\u003e\u003c/ul\u003e \u003cp\u003ePerfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, \u003ci\u003eThermal Management for Opto-electronics Packaging and Applications\u003c/i\u003e will also benefit advanced students focusing on the design of LED product design.
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