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Integration of Mechanical and Manufacturing Engineering with IoT
Hoofdkenmerken
Auteur: R. Rajasekar, C. Moganapriya, M. Harikrishna Kumar, P. Sathish Kumar
Titel: Integration of Mechanical and Manufacturing Engineering with IoT
Uitgever: Wiley Global Research (STMS)
ISBN: 9781119865377
ISBN boekversie: 9781119865001
Editie: 1
Prijs: € 181,04
Verschijningsdatum: 10-02-2023
Inhoudelijke kenmerken
Categorie: Industrial Engineering
Taal: English
Imprint: Wiley-Scrivener
Technische kenmerken
Verschijningsvorm: E-book
 

Inhoudsopgave:

\u003cb\u003eINTEGRATION OF MECHANICAL AND MANUFACTURING ENGINEERING WITH IOT\u003c/b\u003e \u003cp\u003e\u003cb\u003eThe book provides researchers, professionals, and students with a resource on the basic principles of IoT and its applications, as well as a guide to practicing engineers who want to understand how the Internet of Things can be implemented for different fields of mechanical and manufacturing engineering.\u003c/b\u003e \u003cp\u003eThis book broadly explores the latest developments of IoT and its integration into mechanical and manufacturing engineering. It details the fundamental concepts and recent developments in IoT \u0026 Industry 4.0 with special emphasis on the mechanical engineering platform for such issues as product development and manufacturing, environmental monitoring, automotive applications, energy management, and renewable energy sectors. Topics and related concepts are portrayed comprehensively so that readers can develop expertise and knowledge in the field of IoT. It is packed with reference tables and schematic diagrams for the most commonly used processes and techniques, thereby providing a resource on the basic principles and application of IoT in manufacturing sectors. \u003cp\u003e\u003cb\u003eAudience\u003c/b\u003e \u003cp\u003eThe book will be read by academic researchers, industry engineers, and R\u0026D personnel in materials, information and technology, artificial intelligence, and manufacturing. The book will greatly assist graduate students.
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